Advanced
OSAT Hub
Operating the region's first Class 1 cleanroom for wafer probing, back-grinding, and advanced wire bonding for secure silicon packaging.
Wafer Testing (Probing)
Automated electrical testing and defect mapping for 200mm and 300mm wafers using high-precision probe stations.
Back-Grinding & Dicing
Mechanical and laser dicing solutions for ultra-thin wafers, essential for high-density smart card integration.
Wire Bonding & Assembly
Advanced gold and copper wire bonding for secure elements in Class 1 cleanroom environments.
Reliability & QA
Reliability stress testing (HTOL, HAST) and complex failure analysis for mission-critical silicon.
Technical Excellence
Domestication of
Silicon Assembly
ASMC's OSAT facilities enable regional technical independence by providing the critical back-end manufacturing steps required to transform raw silicon wafers into mission-critical secure elements.
Evaluate Our Cleanroom Capacity
Contact our facilities manager to discuss wafer probing, back-grinding, or specialized wire-bonding requirements for your secure element projects.