Capabilities
Semiconductor Assembly (OSAT)
Operating the region's first Class 1 cleanroom for wafer probing, back-grinding, and advanced wire bonding for secure silicon packaging.
Smart Card Manufacturing
High-volume production of the complete spectrum of secure cards, including SIM, NB-IoT, ATM, and biometric National ID programs.
Secure Identity Solutions
End-to-end development of sovereign identity frameworks, cryptographic applets, and secure data personalization for national registries.
End-to-End
Manufacturing
Authority
From semiconductor design and testing to high-speed secure card embedding, ASMC operates the region's only integrated technical value chain.
Semiconductor
Packaging & Assembly
Our Class 1 Cleanroom facility is optimized for the OSAT (Outsourced Semiconductor Assembly and Test) market, bridgeing the gap between silicon design and final product deployment.
Wafer Testing (Probing)
Automated electrical testing and defect mapping for 200mm and 300mm wafers using high-precision probe stations.
Back-Grinding & Dicing
Mechanical and laser dicing solutions for ultra-thin wafers, essential for high-density smart card integration.
Wire Bonding & Packaging
Advanced gold and copper wire bonding for secure elements in Class 1 cleanroom environments.
Quality Assurance (QA)
Reliability stress testing (HTOL, HAST) and complex failure analysis for mission-critical silicon.
Card Body Lamination
Large-scale PC/PVC card body production with focus on physical security and durability.
Chip Module Embedding
High-speed automated embedding of dual-interface (DI) modules into precision-milled card bodies.
Secure Personalization
High-volume electrical data encoding and secure laser engraving for identity and payment cards.
OS & Applet Management
Development and loading of Java Card OS profiles, custom applets, and remote file management (RFM).
Smart Card
Personalization Hub
Our high-volume production facility delivers secure identity and payment cards at scale, with an annual capacity of over 200 million cards.
Mastering Technical
Precision
Every stage of the ASMC value chain is managed within a high-security framework. Our Quality Assurance Lab ensures that all silicon and smart card products exceed international reliability standards (EMVCo, ).
Hardware Security
Integrated physical tamper detection in all secure element packaging.
Industrial Power
Redundant power systems and secure data backups for zero-downtime manufacturing.
Leverage Our Infrastructure
ASMC is your technical partner for regional semiconductor assembly and large-scale secure card production.